Method and apparatus for inverted vortex generator for enhanced cooling

ABSTRACT

Some embodiments of a method, apparatus and computer system are described for inverted vortex generator enhanced cooling. In various embodiments an apparatus may comprise a first surface comprising at least one heated component, a second surface in proximity to the first surface, the second surface comprising a non-heated surface, and one or more inverted vortex generators attached to the non-heated surface, a portion of the one or more inverted vortex generators in proximity to and configured to dissipate heat from the at least one heated component. Other embodiments are described.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a continuation-in-part of pending U.S. patent application Ser. No. 12/021,681 filed on Jan. 29, 2008 which is hereby incorporated by reference.

BACKGROUND

1. Technical Field

Some embodiments of the invention generally relate to cooling systems. More specifically, some embodiments relate to an apparatus, computer system and method for enhancing the transfer of heat.

2. Discussion

In recent years, electronic components and systems have been made to operate at faster speeds. These and other developments, such as processors with one or more cores provide better performance, decrease the size and weight of components, and increase the density of components. Generally, these factors increase the heat generated by electronic components and the systems in which they reside. This is particularly true in mobile or small form factor computing environments, where these factors can lead to overheating, which can negatively affect performance, as well as significantly reduce battery life.

The above-mentioned factors increase the need for effective cooling of electronic components. FIG. 1 illustrates a conventional configuration of a cooling apparatus in a computer system 100. The computer system 100 includes a housing 101, a central processing unit (CPU) 102, and one or more electronic components 104, such as 104 a and 104 b. The CPU 102 is typically in contact with a heat spreader 106 which is in close proximity to a fan 108. The fan 108 forces air out of the computer system 100 by passing through the heat spreader 106. The fan 108 thus serves to establish a direction for air flow, shown at 110, within which external air comes into the system at one or more of the air intakes 112.

As previously mentioned, increases in operating temperatures may negatively affect the performance of the computer system. Therefore, there is a need for an enhanced cooling system for computer systems. In particular, there is a need for cooling systems that are more efficient at transferring heat from electronic components and computer systems.

BRIEF DESCRIPTION OF THE DRAWINGS

Various advantages of embodiments of the present invention will become apparent to one of ordinary skill in the art by reading the following specification and appended claims, and by referencing the following drawings, in which:

FIG. 1 illustrates a example of conventional cooling in a computer system;

FIG. 2 illustrates an example of one or more enhanced cooling apparatuses according to some embodiments of the invention;

FIG. 3 illustrates an example of a vortex generator apparatus according to some embodiments of the invention;

FIG. 4 illustrates an example of a vortex generator apparatus according to some embodiments of the invention;

FIG. 5 illustrates examples of vortex generator types according to some embodiments of the invention;

FIG. 6 illustrates a flowchart for vortex generator enhanced cooling according to some embodiments of the invention;

FIG. 7 illustrates an example of an inverted vortex generator according to some embodiments of the invention;

FIG. 8 illustrates an example of an inverted vortex generator apparatus according to some embodiments of the invention; and

FIG. 9 illustrates an embodiment of a flow chart.

DETAILED DESCRIPTION

Reference is made to some embodiments of the invention, examples of which are illustrated in the accompanying drawings. While the invention will be described in conjunction with the embodiments, it will be understood that they are not intended to limit the invention to these embodiments. On the contrary, the invention is intended to cover alternatives, modifications and equivalents, which may be included within the spirit and scope of the invention as defined by the appended claims.

Moreover, in the following detailed description of the invention, numerous specific details are set forth in order to provide a thorough understanding of the invention. However, the invention may be practiced without these specific details. In other instances, well-known methods, procedures, components and circuits have not been described in detail as not to unnecessarily obscure aspects of the invention.

Indeed, reference in the specification to an embodiment or some embodiments of the invention means that a particular feature, structure or characteristic described in connection with the embodiment is included in at least one embodiment of the invention. Thus, the appearances of the phrase “in one embodiment” or “according to an embodiment” appearing in various places throughout the specification generally are not referring to the same embodiment.

FIG. 2 illustrates an example of one or more enhanced cooling apparatuses in a cooling system according to some embodiments of the invention. According to some embodiments of the invention, a computer system 200 may include a housing 101, a central processing unit (CPU) 102, and one or more electronic components 104, shown as 104 a and 104 b. The CPU 102 may be in contact with a vortex generator enabled heat spreaders (VGHS) 202 c which may further include a fan 108. The fan 108 may promote a flow of air out of the computer system 200. The fan 108 may serve to establish a direction for air flow, shown at 110, within which external air comes into the system at air intake 112.

In some embodiments, the transfer of heat may be enhanced by the addition of one or more VHGS 202, shown as 202 a, 202 b, and 202 c. For example, according to some embodiments, the VGHS 202 a may generate, in the locality of the electronic component 104 a, an increase in the turbulence of the air near the electronic component 104 a. In some embodiments, the vortex generators (VGes or generators) of the VGHS 202 may have delta wing shapes for local enhancement of heat transfer. In some embodiments, the generators may have a different shape, such as that of a post, fence, sawtooth, or other shape as is described elsewhere herein.

The vortex generators may promote turbulence via the formation of small eddies that are shed in the wake of the flow as it passes them. As one of ordinary skill in the relevant art would appreciate, turbulence may include random vertical motions in the flow of air with either or both spatial or temporal irregularities. This turbulence may enhance the local dissipation of heat or thermal energy, as one of ordinary skill in the relevant art would appreciate based at least on the teachings provided herein. In some embodiments, the vortex generators may be placed near power dissipating components, such as those described herein or other localized hot spots in or on the computer system. In some embodiments, the computer system 200 may use less or nearly the same power with the VGHS placed within the system. Furthermore, the computer system 200 may include different air intakes 112 when enabled with the VGHS than without, as one of ordinary skill in the relevant art would appreciate the air flow requirements based at least on the teachings provided herein.

As such, in some embodiments of the invention, the VGHS 202 a may provide a zone of turbulent air. The increase in air turbulence may remove a larger amount of heat from the electronic component 104 a and into the air flow. In some embodiments, the air flow may be improved by an air mover 204 a. In some embodiments, as described elsewhere herein with respect to the VGHS 204 c, the fan 108 may be used. In alternative embodiments, the VGHS 202 a may be positioned to enhance an air flow in a different direction, such as toward the housing 101 and/or away from any other components of the computer system 200. In some embodiments, the VGHS 202 may not increase the velocity of air, but rather alter the shape or volume of the velocity air and/or thermal boundary layer in order to increase the heat dissipation from the electronic component(s) 104 and/or CPU 102.

According to some embodiments of the invention, an apparatus for the enhancement of heat transfer may include the VGHS 202. The VGHS may be internally coupled to an electronic device and positioned with respect to an electronic component, according to some embodiments. Furthermore, in some embodiments, the electronic component 104 may include a heat spreader, heat sink, or heat exchanger, as is described elsewhere herein. Furthermore, the VGHS 202 may not have a separate heat spreader, or the heat spreader of the VGHS may be integrated into the electronic component 104 or CPU 102, as one of ordinary skill in the relevant art would appreciate based at least on the teachings described herein. In some embodiments, the VGHS, according to some embodiments, may only include the vortex generators arranged on the surface of the electronic component. In such embodiments, the electronic component may be constructed in a manner to support the placement and/or arrangement of the vortex generators on its surface.

In some embodiments, the VGHS 202 may be integrated into a heat spreader, such as, but not limited to, heat spreader 106, and may be constructed from the same material or from the same material. In addition, according to some embodiments, the VGHS 202 may be coupled to an electronic component, such as, but not limited to, electronic components 104.

Furthermore, in some embodiments of the invention, the electronic component may be one of a central processing unit (CPU), a processor, a memory, a hard drive, a network card, a video graphics card, a motherboard, a display, or a heat source. In some embodiments, the computer system may be an electronic device such as a mobile computer, a desktop computer, a server computer, or a handheld computer as one of ordinary skill in the relevant art would appreciate based at least on the teachings described herein.

In addition, with respect to FIG. 2, in some embodiments, the VGHS 202, such as VGHS 202 b, may be used in combination with or integrated with an air mover 204, as shown with air movers 204 a and 204 b or fan 108. Various designs of air movers are well-known in the art and one of ordinary skill in the relevant art(s) would appreciate, based at least on the teachings described herein, how to use and position at least one of a coaxial fan, an axial fan, a piezoelectric fan, a membrane fan or other type of air mover to promote the flow of air over the VGHS.

Similarly to VGHS 202 a, the VGHS 202 b may provide, in the locality of the electronic component 104 b, an increase in the turbulence of the air over the electronic component 104 b. The increase in air turbulence may remove a larger amount of heat from the electronic component 104 b and into the air flow. In alternative embodiments, the VGHS 202 b may be positioned to enhance an air flow in a different direction, such as away from any other components of the computer system 200.

In some embodiments, a VGHS 202 c may be positioned with respect to the CPU 102. In some embodiments, the CPU 102 may include a microprocessor, a multiple core processor, or the like. The position of the VGHS 202 c may be in close proximity to the CPU 102, according to some embodiments of the invention. The VGHS 202 c may enhance the heat transfer from the CPU 102 to the air flow 110, which exits the computer system 200 due, at least in part, to the operation of fan 108.

In some embodiments of the invention, as one of ordinary skill in the relevant art would appreciate, based at least on the teachings described herein, that the embodiments of the invention may not require more than one VGHS. Furthermore, that one of ordinary skill would appreciate that the heat spreader portion of the VGHS 202 and fan 108 may be replaced with alternative primary cooling systems that are able to make use of the vortex generators and/or VGHS. Indeed, the embodiments of the VGHS may be readily implemented in various cooling systems where an enhancement of air or fluid flow, such as, but not limited to liquid flow, through the system may transfer heat from electronic components as is described elsewhere herein.

FIG. 3 illustrates an example of a vortex generator heat spreader (VGHS) apparatus 300, according to some embodiments of the invention. The apparatus 300 may include a VGHS 302 with one or more vortex generators 306. In some embodiments, the generators may have a triangular or delta-winged shape, as shown in, at least, FIG. 3. In some embodiments, the generators may have alternate shapes, as is described in further detail elsewhere herein.

Moreover, in some embodiments, the generators may be placed in various patterns, such as, but not limited to, generally straight rows or columns, generally diagonally placed, generally circular or random placements, or a combination of placements. Furthermore, in some embodiments, the generators may be of generally the same or different sizes, shapes, or configurations. As is described in further detail elsewhere herein, the configurations, shapes and sizes of the generators may be altered to provide different affects on the flow passing near it, as one of ordinary skill in the relevant art would appreciate based at least on the teachings provided herein.

The apparatus 300 may optionally include an air mover or fan 304, which in some embodiments of the invention may include a blower-type fan, coaxial fan, axial fan, a piezoelectric fan, a membrane fan, or other type of air mover as one of ordinary skill in the relevant art would appreciate based at least on the teachings provided herein. In some embodiments of the invention, the air mover 302 may be coupled, either directly or indirectly, to a power source by power connection (not shown). The power source may be from the computer system or one of its components, as one of ordinary skill in the relevant art would appreciate based at least on the teachings described herein.

FIG. 4 illustrates an example of a vortex generator apparatus 400 according to some embodiments of the invention. The apparatus 400 may include a VGHS 408, such as, but not limited to VGHS 408A and/or VGHS 408B, which may be positioned in proximity with the heat spreader or the electronic component to produce an increase in the turbulence of an air flow 410 over an electronic component 406, according to some embodiments of the invention. The flow of air 410 may result in a turbulent flow of air 412, as shown, where, the flow of air 412 may include dissipated heat or thermal energy from the electronic component 406. Furthermore, the component 406 and/or air mover 404 may be optionally coupled to a board 402, such as, but not limited to, a motherboard or part of the housing of the system.

As shown in the embodiments of at least FIGS. 3 and 4, the use of one or more vortex generators, such as, but not limited to VG 306, may enhance, in some cases significantly enhance, the local heat transfer coefficient(s) of the apparatus and/or system. One of ordinary skill in the relevant art would appreciate that the enhancement may depend on other factors of the apparatus or system, such as, but not limited to, the Reynolds number of the flow and the VG configurations, some of which are described below. For example, in some embodiments, the computer system 200 may make use of larger or more air intakes 112 rather than one or more air movers 204 or fan 108, as the extra intake of air may provide enough flow for the VGes and/or VGHSes to provide for an increase in the localized heat transfer at the same or similar flow rate by creating turbulence. As a result, in some embodiments, the use of one or more VGes and/or VGHSes instead of one or more air movers may provide for reduced power usage and/or requirements for the system, such as computer system 200.

FIG. 5 illustrates embodiments 500 and 512-522 of vortex generators according to some embodiments of the invention. In some embodiments, the generators may be shaped in triangular or delta-wing shapes, as shown in 500. In embodiment 500, a schematic of a row of delta winged vortex generators is shown. Some of the parameters of the generators are noted, such as its height (e) 510, length (L or l) 508, and pitch (p) 506. Moreover, other notable parameters for the configuration of the generators include hydraulic diameter (D_(h)) of the system in which the apparatus or generators are placed, the generator width (b) 502, and angle of the delta shape (2α) 504.

As one of ordinary skill in the relevant art would appreciate, based at least on the teachings provided herein, the performance of the generators may be changed by altering one or more of the parameters described herein. Moreover, in some embodiments, the parameters may be combined to form expressions and/or ratios that are similarly known to one of ordinary skill in the relevant art. For example, a Reynolds number or range of numbers, which is a dimensionless parameter used in fluid mechanics and associated fields to represent a ratio of inertia forces to viscous forces, may be determined, in part, from the flow's velocity and viscosity, and the length 508. As such, one of ordinary skill in the relevant art would appreciate that altering these parameters, as well as obtaining measurements of at least the Reynolds number for a system or apparatus, may provide for increase in the turbulence of the flow and an enhancement in heat transfer from the electronic component.

Moreover, in some embodiments, the generators may also be shaped as posts 512, fences 514, or slats 516, as well as sawtooths 518 (also known as dogtooths), circular or elliptical generators 520, or crescents 522. The generators, in some embodiments, independent of their shape, may also have thick trailing edges, drooped leading edges, or leading-edge notches, which may produce similar effects as the shapes of the generators. As one of ordinary skill in the relevant art(s) would appreciate based at least on the teachings provided herein, each shape or configuration may have different advantages or drawbacks, such as, but not limited to, increased drag.

FIG. 6 illustrates a flowchart for vortex generator enhanced cooling according to some embodiments of the invention. According to some embodiments, the process may begin at 602 and proceed to 604, where it may place one or more vortex generators in proximity with a heat spreader to enhance the transfer of heat over an electronic component. In some embodiments, the one or more vortex generators may be shaped as delta wings, posts, fences, slats, sawtooths, ellipses, or crescents. Moreover, in some embodiments, the heat spreader may be integrated into the electronic component, such that the one or more vortex generators may be placed directly on the electronic component.

The process may then proceed to 606, where it may provide a flow of air over the one or more vortex generators. In some embodiments, each vortex generator may promote turbulence in the flow of air. The process then may proceed to 608, where it may operates the electronic component. In some embodiments of the invention, the operation may be in conjunction or combination with the operation of an electronic device or computer system.

The process 600 may then proceed to 610, where it terminates and may be repeated as one of ordinary skill in the relevant art would appreciate, based at least on the teachings provided herein. According to some embodiments, one or more of 604, 606, and/or 608 may occur independently.

In various embodiments, it may be difficult to include vortex generators on the surface of an electronic component and it may be impractical to integrate vortex generators into a heat spreader. Additionally, in some embodiments a heat spreader may not be near the component that requires cooling. This may be particularly true in the case of mobile computing devices in which space is limited. As a result, an inverted vortex generator may be desired.

FIG. 7 illustrates one embodiment of an inverted vortex generator 700. Inverted vortex generator 700 may include, for example, a body 701, a base 702, a tab 704 and a junction 706. It should be understood that while inverted vortex generator 700 is shown as including tab 704, inverted vortex generator 700 may, in various embodiments, not include tab 704 and still fall within the described embodiments. For example, in place of tab 704, inverted vortex generator 700 may include a tip or any other shape suitable for attaching inverted vortex generator 700 to a surface.

In various embodiments, the base 702 of the inverted vortex generator 700 has a width that is greater than the width of the tab 704. In this manner, the inverted vortex generator 700 may comprise a substantially triangular shape. In some embodiments, the inverted vortex generator 700 may also be shaped as a post, fence, slat, sawtooth, circle or crescent as described in more detail with reference to FIG. 5.

In some embodiments, inverted vortex generator 700 may comprise a vertical pedestal. A vertical pedestal may comprise a portion of inverted vortex generator 700 formed between body 701 and tab 704, for example. In various embodiments, the vertical pedestal is formed substantially perpendicular to the tab 704 and the surface to which the inverted vortex generator is attached. Vertical pedestal may add separation between the body 701 and the surface to which the inverted vortex generator 700 is attached in some embodiments. Use of a vertical pedestal may allow for the attachment of the inverted vortex generator 700 in closer proximity to an electronic component at varying angles of attachment, for example.

Junction 706 may comprise any point of attachment between the body 701 of the inverted vortex generator 700 and the tab 704. Junction 706 may be formed from any material suitable for adjusting the angle at which the inverted vortex generator 700 is attached to a surface. In some embodiments, body 701, tab 704 and junction 706 may be formed from the same piece of material. In various embodiments, inverted vortex generator 700 may be formed into or made part of the body or housing of a mobile computing device.

Inverted vortex generator 700 may perform a function similar to that described above with reference to VGHS. That is, inverted vortex generator 700 may be positioned in proximity to an electronic component and may receive a flow of air that results in a turbulent flow of air including dissipated heat or thermal energy from the electronic component. Additionally, inverted vortex generators may be placed in various patterns, such as, but not limited to, generally straight rows or columns, generally diagonally placed, generally circular or random placements, or a combination of placements. Furthermore, in some embodiments, inverted vortex generators 700 may be of generally the same or different sizes, shapes and configurations.

FIG. 8 illustrates one embodiment of an inverted vortex generator apparatus 800. Inverted vortex generator apparatus 800 may include a board 802, an electronic component 804, an air mover 806, a first flow of air 808A, a second flow of air 808B, a first non-heated surface 810A, a second non-heated surface 810B and one or more inverted vortex generators 812A-812F. In various embodiments, inverted vortex generator apparatus 800 may comprise a mobile computing device, such as a laptop computer, for example. Other embodiments are described and claimed.

In various embodiments, optional board 802 may comprise a PCB, mounting board or any other board suitable for supporting an electronic component such as electronic component 804. Electronic component 804 may comprise, for example, a CPU, a processor, a memory, a hard drive, a network card, a video graphics card, a motherboard, a display or any other heat source within a computing device. Optional air mover 806 may be similar to air mover 204 described above with reference to FIG. 2.

In various embodiments, first non-heated surface 810A and second non-heated surface 810B may comprise any non-heated surface in proximity to an electronic component that is capable of supporting, or having attached thereto, one or more inverted vortex generators 812A-812F. In some embodiments, non-heated surfaces 810A and 810B may comprise the housing of the mobile computing device. Non-heated surfaces 810A and 810B may also comprise the shell or skin of a notebook computer in some embodiments.

Inverted vortex generators 812A-812F may comprise, for example, inverted vortex generators similar to inverted vortex generator 700 of FIG. 7 in various embodiments. Other embodiments are described and claimed.

In various embodiments, electronic component 804 may comprise a first surface having at least one heated component. For example, electronic component 804 may comprise a processor that heats up as it receives power and performs processing operations. Non-heated surfaces 810A and 810B may comprise second surfaces in proximity to the first surface. For example, non-heated surfaces 810A and 810B may comprise the shell of a notebook computer, proximally positioned with respect to a processor. As shown in FIG. 8, non-heated surfaces 810A and 810B may be positioned above or below the at least one heated component respectively.

In some embodiments, one or more inverted vortex generators, such as inverted vortex generators 812A-812F, may be attached to at least one of the non-heated surfaces with a portion of the one or more inverted vortex generators 812A-812F in proximity to and configured to dissipate heat from the at least one heated component. For example, inverted vortex generator 812A may be attached to non-heated surface 810A and positioned in close proximity to electronic component 804. In various embodiments, inverted vortex generator 812A is positioned close to, but not touching electronic component 804. For example, a gap of 1-10 millimeters may be present between the inverted vortex generators and the heated component. While a specific gap dimension has been described, it should be understood that any gap size may be selected to dissipate a desired amount of heat based on space requirements and geometry.

Inverted vortex generators 812A-812F may be attached to one of non-heated surfaces 810A or 810B in any manner suitable for such attachment. For example, the inverted vortex generators 812A-812F may be soldered, welded, taped, glued, riveted, formed as part of or molded into one of non-heated surfaces 810A or 810B. In some embodiments, each inverted vortex generator 812A-812F is angled upward or downward toward the electronic component 804 depending upon attachment to either non-heated surface 810A located above electronic component 804 or non-heated surface 810B located below electronic component 804. The angle of attachment may be selected based on space limitations in the inverted vortex generator apparatus and also based on the amount of desired heat dissipation.

The one or more inverted vortex generators may comprise one or more substantially triangular shaped delta wings having a tip for attachment to a secondary or non-heated surface and a base in proximity to at least one heated component in some embodiments. In various embodiments, the tip of the one or more delta wings further comprises a tab for attachment to the secondary surface. For example, tab 704 of inverted vortex generator 700 may be attached to non-heated surface 810A and the inverted vortex generator may be angled downward toward electronic component 804 in various embodiments.

In some embodiments, the at least one heated component or heated surface 804 further comprises a heat spreader. A heat spreader may comprise, for example, a thermally conductive material arranged to transfer heat away from a heat source. If a heat spreader is included with or near the heated surface, the one or more inverted vortex generators 812A-812F may be positioned in proximity to the heat spreader to further enhance heat transfer.

In some embodiments, the one or more inverted vortex generators comprise a single inverted vortex generator having a base similar in size to a size of the least one heated component. For example, the base 702 of inverted vortex generator 812A may be of a width substantially equivalent to at least one dimension of electronic component 804. The one or more inverted vortex generators may alternatively comprise a plurality of inverted vortex generators with a portion of each of the plurality of inverted vortex generators configured to overlap a portion of the at least one heated component. Other embodiment are described and claimed.

FIG. 9 illustrates one embodiment of a flow chart. According to some embodiments, the process may begin at 902 and proceed to 904, where a flow of air may be received over one or more inverted vortex generators in proximity to at least one electronic component to promote turbulence in the flow of air. For example, a flow of air 808A from air mover 806 may be received at inverted vortex generators 812A-812C to promote turbulence in the proximity of electronic component 804. At 904, heat is dissipated from the at least one electronic component. For example, air flow 808B may comprise a turbulent flow of air that includes dissipated heat or thermal energy from the electronic component 804.

In some embodiments, the one or more inverted vortex generators may be attached to a housing of a computing device using a tab on the one or more inverted vortex generators with the one or more inverted vortex generators comprising substantially triangular shaped delta wings. For example, the inverted vortex generators may comprise inverted vortex generator 700, including a triangular shape and a tab 704, attached in the manner illustrated in FIG. 8.

In various embodiments, the one or more delta wings may be configured with a base in proximity to the at least one electronic component and the tab attached to the housing. For example, inverted vortex generator 812A may have its base 702 in proximity to electronic component 804 and may have its tab 704 attached to non-heated surface 810A, which in some embodiments may comprise the housing of a computing device. Other embodiments are described and claimed.

Embodiments of the invention may be described in sufficient detail to enable those skilled in the art to practice the invention. Other embodiments may be utilized, and structural, logical, and intellectual changes may be made without departing from the scope of the present invention. Moreover, it is to be understood that various embodiments of the invention, although different, are not necessarily mutually exclusive. For example, a particular feature, structure, or characteristic described in one embodiment may be included within other embodiments. Those skilled in the art can appreciate from the foregoing description that the techniques of the embodiments of the invention can be implemented in a variety of forms.

Therefore, while the embodiments of this invention have been described in connection with particular examples thereof, the true scope of the embodiments of the invention should not be so limited since other modifications will become apparent to the skilled practitioner upon a study of the drawings, specification, and following claims. 

1. An apparatus, comprising: a first surface comprising at least one heated component; a second surface in proximity to the first surface, the second surface comprising a non-heated surface; and one or more inverted vortex generators attached to the non-heated surface, the one or more inverted vortex generators comprising one or more substantially triangular shaped delta wings having a tip attached to the second surface and a base in proximity to the at least one heated component, wherein the base has a width that is greater than a width of the tip and the one or more inverted vortex generators are configured to dissipate heat from the at least one heated component.
 2. The apparatus of claim 1, the tip of the one or more delta wings further comprising a tab for attachment to the second surface.
 3. The apparatus of claim 1, the one or more inverted vortex generators comprising a single inverted vortex generator having a base similar in size to a size of the at least one heated component.
 4. The apparatus of claim 1, the one or more inverted vortex generators comprising a plurality of inverted vortex generators, each of the plurality of inverted vortex generators configured to overlap a portion of the at least one heated component.
 5. The apparatus of claim 1, the second surface positioned below the first surface and the one or more inverted vortex generators angled upward from the second surface toward the first surface.
 6. The apparatus of claim 1, the second surface positioned above the first surface and the one or more inverted vortex generators angled downward from the second surface toward the first surface.
 7. The apparatus of claim 1, the at least one heated component comprising at least one electronic component.
 8. The apparatus of claim 7, the at least one heated component further comprising a heat spreader, the one or more inverted vortex generators in proximity to the heat spreader.
 9. A system, comprising: a housing; and one or more inverted vortex generators attached to the housing, the one or more inverted vortex generators comprising one or more substantially triangular shaped delta wings having a tab for attachment to the housing and a base in proximity to at least one electronic component, wherein the base has a width that is greater than a width of the tab and the one or more inverted vortex generators are configured to dissipate heat from the at least one electronic component.
 10. The system of claim 9, the one or more inverted vortex generators comprising a single inverted vortex generator having a base similar in size to a size of the at least one electronic component.
 11. The system of claim 9, the one or more inverted vortex generators comprising a plurality of inverted vortex generators, each of the plurality of inverted vortex generators configured to overlap a portion of the at least one electronic component.
 12. The system of claim 9, further comprising a heat spreader in proximity to the at least one electronic component.
 13. The system of claim 9, further comprising an air mover to increase a flow of air in the housing.
 14. The system of claim 9, the one or more inverted vortex generators integrated into the housing.
 15. A method, comprising: receiving a flow of air over one or more inverted vortex generators in proximity to at least one electronic component to promote turbulence in the flow of air and to dissipate heat from the at least one electronic component, wherein the one or more inverted vortex generators comprise one or more substantially triangular shaped delta wings having a base in proximity to the at least one electronic component and a tab configured to attach the inverted vortex generator to a housing, wherein the base has a width that is greater than a width of the tab.
 16. The method of claim 15, further comprising attaching the one or more inverted vortex generators to a housing of a computing device using a tab on the one or more inverted vortex generators, the one or more inverted vortex generators comprising substantially triangular shaped delta wings.
 17. The method of claim 16, the one or more delta wings configured with a base in proximity to the at least one electronic component and the tab attached to the housing.
 18. The method of claim 15, further comprising receiving the flow of air from an air mover. 